Deployment story
AgiBot G2 trials semiconductor logistics at Huatian Technology
An April 2026 application report names G2 and Huatian, but not the plant or underlying reliability measurements.
Xinhua's April 18, 2026 account of AGIBOT's partner conference identifies G2 at semiconductor packaging and testing company Huatian Technology. The application combines navigation through a large workshop with logistics and manufacturing-system integration.
The report carries claims of a defect rate below 0.001% and MTBF above seven days. These are attributed application claims without public failure definitions, event logs or sample size. They are not independently verified reliability statistics, and a workshop's floor area is not a robot's completed travel distance.
The case is kept as a qualified pilot because the exact production station, customer acceptance and installed fleet are unreported. It matters as an integration problem across materials flow and factory IT, rather than a standalone handling demonstration. No plant city is guessed from Huatian's name or headquarters. Further evidence should identify the facility and separate navigation, handling and downstream process failures.